NCP5008, NCP5009
PACKAGE DIMENSIONS
Micro10
CASE 846B?03
ISSUE D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION “A” DOES NOT INCLUDE MOLD
?A?
FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE
BURRS SHALL NOT EXCEED 0.15 (0.006)
PER SIDE.
4. DIMENSION “B” DOES NOT INCLUDE
K
?B?
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION
SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
5. 846B?01 OBSOLETE. NEW STANDARD
846B?02
?T?
PIN 1 ID
G
0.038 (0.0015)
SEATING
PLANE
H
D 8 PL
0.08 (0.003)
C
J
M
T B
S
A
S
L
DIM
A
B
C
D
G
H
J
K
L
MILLIMETERS
MIN MAX
2.90 3.10
2.90 3.10
0.95 1.10
0.20 0.30
0.50 BSC
0.05 0.15
0.10 0.21
4.75 5.05
0.40 0.70
INCHES
MIN MAX
0.114 0.122
0.114 0.122
0.037 0.043
0.008 0.012
0.020 BSC
0.002 0.006
0.004 0.008
0.187 0.199
0.016 0.028
SOLDERING FOOTPRINT*
10X
1.04
0.041
3.20
0.126
0.32
0.0126
4.24
0.167
10X
5.28
0.208
8X
0.50
0.0196
SCALE 8:1
mm
inches
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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17
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NCP5008/D
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